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Ceramic Thick-film Circuit |
Seekon has the national lead production line for ceramic thick-film circuit, and the whole sets introduce the advanced workmanship and technology from Italy, all the key equipments are imported from abroad with high level of ceramic thick-film circuit process.
The production line could integrate single side/both sides, multi-layer thick-film circuit, and make wide-range thick-film resistor, capacitor, inductor etc., and realize hole metallization, irregular-shaped ceramic circuit process.
Seekon has good experience of volume production, and strictly executes Quality Management System of ISO9001:2000, to ensure the products with high quality and fast delivery. |
| High Precision Circuit |
Graphic precision and strict error control;
Hole metallization and edge metallization with high reliability;
Precision resistance;
Multi-layers and position precision;
Precision process capability for laser irregular-shaped and abrasive wheel profiling; |
| Data format |
| Electronic files format |
AutoCAD files format: DWG/DXF
Gerber RS-274X |
| Electronic files convention |
Describe with layers in the proportion of 1:1;
Unit: mm;
Drawing with no width straight line, arc, round or Pline to avoid spline curve and ellipse,etc when using AutoCAD;
Another necessary stated files; |
| Through-hole and metallization |
| Film-layer through-hole diameter |
Standard: 0.4x0.4 mm
Senior: 0.2x0.2 mm |
| Minimum substrate through-hole diameter |
Standard: Φ0.4 mm
Senior: Φ0.2 mm |
| Metallization maximum rate for hole depth and hole diameter |
Standard: 1.5:1
Senior: 2.5:1 |
| Profiling process |
| Abrasive cutting dimension precision |
| Standard: ±0.05 mm |
| Laser processing dimension precision |
| Edge-melting dimension: +0.15mm |
